Thermal Management
| Product Information | Manufacturer | Availability | Actions |
|---|---|---|---|
 Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE | Wandboard | In Stock | |
 Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M | Wandboard | In Stock | |
 Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7 | Wandboard | In Stock | |
 Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7 | Wandboard | 25 In Stock |
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